The first die block diagram of AMD's Ryzen 5000 'Cezanne' CPUs based on the Zen 3 architecture has been leaked by Videocardz. The block diagram shows that AMD's Ryzen 5000 'Cezanne' APUs will be sporting some major design changes and are not just a general refresh of the existing 3rd Gen Ryzen 4000 'Renoir' APUs.

AMD Ryzen 5000 'Cezanne' CPU Die Block Diagram Leaks Out, Much Bigger Than Ryzen 4000 'Renoir' Thanks To Zen 3 & Larger Cache

AMD's Ryzen 5000 'Cezanne' CPUs will be based on the Zen 3 core architecture which brings huge gains in IPC and efficiency. It is based on an optimized TSMC 7nm process node but the key Zen 3 changes have mainly been the restructuring of the cache design along with integral core upgrades.

The AMD Ryzen 5000 'Cezanne' CPUs / APUs will be featured on both mobility & desktop platforms. We will first get to see them in action on the mobility front with an announcement expected in the coming week at CES 2021. The Ryzen 5000H and Ryzen 5000U processors based on the Zen 3 core architecture will be adopted by all major OEM partners of AMD. We will also get to see AMD Ryzen laptop CPUs paired with NVIDIA's flagship GeForce RTX GPUs for the first time.

In terms of configurations, Ryzen 5000 Zen 3 CPUs will feature up to 8 cores, 16 threads, 4 MB of L2 cache, 16 MB of L3 cache and 8 enhanced Vega GPU compute units for a total of 512 cores. The L3 cache has seen the biggest upgrade as that was limited to just 8 MB on Ryzen 4000 'Renoir' CPUs. It will definitely help boost the overall CPU and GPU performance of these chips. Looking at the block diagram, the Ryzen 5000 'Cezanne' is larger than Ryzen 4000 'Renoir'. It is estimated that the exact die size of the chip is somewhere around 175mm2 which is 20mm2 larger than Renoir which had a die size of 156mm2.

AMD Ryzen 5000 APU Lineup (Preliminary Specs):