Intel's 200-series chipsets which include the Z270 and H270 platforms have been fully detailed. The new PCH will support the upcoming Kaby Lake processors which are headed for launch on 5th January 2017.
Intel 200-Series (Z270 and H270) Chipsets Detailed For Kaby Lake-S Platform
The two chipsets that will be offered with the new Kaby Lake processors are Z270 and H270. We can confirm with the latestIntel will be offering support for the Kaby Lake and Skylake processors on both 100-series and 200-series motherboards. This means that consumers can use their Skylake chips on a 200-series board or a Kaby Lake chip on a 100-series board.

Intel 200-Series chipsets for Kaby Lake-S Platform Detailed. (Image Credits: Benchlife)
The two new chips are marketed towards specific markets. The Z270 series is aimed at the consumer market while the H270 series is aimed at the consumer and corporate market. We will get on to the features of these chipset which is an update from the previous 100-series generation of products.
Intel Z270 and H270 PCH Features Detailed
Intel Z270 and Z170 offer the same CPU PCIe configuration support. They allow for 1 x 16, 2 x 8 or 1 x 8 + 2 x 4 config whereas the H270 and H170 chipset offers just 1 x 16 config. The total number of independent Display Port offered by the PCH are 3 and power up to four memory DIMMs in Dual Channel mode. The Z Series offers overclocking support while the H Series is restricted from such support. All chipsets offer Intel SmartSound tech but Intel AIB partners will be offering their own custom Audio codecs to power audio.
Moving on, the new 200-series has official support for Optane technology which is not available on 100-series products. Intel Rapid Storage technology is also pushed to 15 (was 14 on 100-series). Some other features in the new chipsets include Raid 0, 1, 5, 10 support, PCIe Storage Drive support, Smart Response Technology and I/O Port flexibility.

Intel has increased the number of high-speed I/O lanes to 30 on both 200-series chipsets. The Z170 had 26 while the H170 had 22 lanes. Total USB ports have remain the same at 14 (10 USB 3.0) for Z Series and 14 (8 USB 3.0) for H Series. All boards would have 6 SATA III 6 GB/s ports. Expansion slots would be powered by 24 PCI-e lanes on Z270 and 20 PCI-e lanes on H270. This is a slight increase over 20 PCI-e lanes on Z170 and 16 on H170.
The KBL-PCH will be able to support Mansion Beach (Optane SSD PCIe/NVMe Gen3 x4), Brighton Beach (Optane SSD PCIe/NVMe Gen3 x4) and Stony Beach (Optane Memory PCIe/NVMe Gen 3 x2 (m.2)) solutions. We covered this topic in more detail over here.
| WCCFTech | AMD Summit Ridge | Intel Kaby Lake |
|---|---|---|
| Product Naming | AMD RYZEN | Intel Core 7000 Series |
| Product Segment | Mainstream Desktop PCs | Mainstream Desktop PCs |
| Product Architecture | x86 Zen (+40% IPC compared to Excavator) | 7th Gen Kaby Lake (Same IPC as Skylake) |
| Process Node | 14nm | 14nm+ |
| Max CPU Cores/Threads | 8/16 | 4/8 |
| GPU Architecture | N/A | Intel HD 600 Series |
| TDP | Up to 95W | Up to 95W |
| Socket | AM4 | LGA 1151 |
| PCH | X370 | Z270 |
| Memory Support | DDR4 | DDR4 |
| Launch | February - March 2017 | January 2017 |









