Samsung has reportedly ordered a significant amount of 2.5D packaging equipment, hinting that the Korean giant might see huge demand from industry giants such as NVIDIA.

Samsung Starts Prepping 2.5D Packaging Supply, Potentially For NVIDIA's Next-Gen "Blackwell" AI GPUs

Samsung has recently stepped into the AI bandwagon with the announcement of its SAINT tech which will rival TSMC's CoWoS packaging solution. With this, Samsung is expected to offer its packaging and HBM capabilities to the industry and has been able to grasp the attention of none other than NVIDIA. We all are well aware that currently, Team Green is unable to keep up with the immense demand from the AI markets and they plan on diversifying their supply chain with the likes of Samsung playing a vital role in Team Green's prospects in the data center segment.

The Elec reports that Samsung has acquired 16 units of packaging equipment from the Japanese firm Shinkawa, with the deal having space for more units depending on what kind of demand Samsung sees from its clients.

NVIDIA's aim to generate a whopping $300 billion from the AI segment by 2027 does require a consistent supply chain, which is why it is said that for the production of next-gen AI GPUs such as 2024's Blackwell, Team Green plans on allocating HBM3 and 2.5D packaging supply to Samsung, reducing the workload on existing vendors like TSMC.

This is great news for Samsung indeed since the firm was dire to step into the "AI bandwagon", and through securing a deal with NVIDIA, not only could the company see an economic upturn in its memory and AVP (Advanced Package) divisions, but the Korean giant has already been able to secure orders from the likes of AMD and Tesla as well, showing that it could indeed emerge as a key player going ahead. It all depends on how Samsung deals with the immense demand from markets, especially since it has secured orders for its semiconductor, packaging, and memory processes.

News Source: The Elec