Less than a month ago, SK Hynix had confirmed the development of a new 24GB HBM3 memory with an immensely high bandwidth performance of 819GB/s per stack. This was an introduction to their next-gen high-bandwidth memory. And, since next-gen CPUs and GPUs will require faster and stronger memory, HBM3 might be the answer to the needs of newer memory technology.

SK Hynix Shows Off HBM3 Memory Module With 12-Hi 24 GB Stack Layout & 6400 Mbps Speeds

Now, during the OCP Summit 2021, SK Hynix officially released the details of their next-gen memory modules. JEDEC, the group "responsible for HBM3," has still not released final specs on the new standard of memory modules. However, SK Hynix has published specifications from their initial tests, showing speeds of 5.2 Gbps to 6.4 Gbps. Unfortunately, we do not know which one of the two speeds will be close to what will be globally produced for "next-gen accelerators."

This recent 5.2 to 6.4 Gbps module featured a total of 12 stacks with each connected to a 1024-bit interface. Since the controller bus width for HBM3 has not changed since its predecessor, a fairly large number of stacks in conjunction with higher frequencies causes an increase of bandwidth speeds per stack, ranging from 461 GB/s to 819 GB/s.

SK Hynix shows off 24 GB HBM3 package with 12-Hi stack and 6400 Mbps transfer speeds. (Image Credits: ServerTheHome)

Anandtech has recently published a comparison chart showing the different HBM Memory, from HBM to the new HBM3 modules:

HBM Memory Specifications Comparison