The next-generation AMD SP5 socket featuring 6096 LGA contact pads to support AMD's future generation of EPYC CPUs has been pictured.
AMD's Massive SP5 Socket That Will Power Future EPYC CPUs Has Been Pictured In All Its Glory
The latest pictures come from forum member of STH (ServerTheHome, 111alan. This is the first close-up and physical look of the AMD SP5 socket that we have gotten so far. As expected, AMD's SP5 socket will feature 6096 LGA contact pads to support the future generation of EPYC CPUs such as Genoa (up to 96 cores) and Bergamo (up to 128 cores). The pictured socket is from a dual 2P platform which houses two SP5 sockets and a total of 24 DIMM slots (2 DIMMs per channel for a total of 12 channel memory support).
The LGA 6096 socket will feature6096 pins arranged in the LGA (Land Grid Array) format. This will be by far the biggest socket that AMD has ever designed with 2002 more pins than the existing LGA 4094 socket. We have already listed the size and dimensions of this socket above so let's talk about its power ratings. It looks like the peak power of the LGA 6096 SP5 socket will be rated at up to 700W which will only last for 1ms, the peak power at 10ms is rated at 440W while the peak power with PCC is rated at 600W. If the cTDP is exceeded, then the EPYC chips featured on the SP5 socket will return to these limits within 30ms.








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AMD EPYC Milan Zen 3 vs EPYC Genoa Zen 4 Size Comparisons:
| CPU Name | AMD EPYC Milan | AMD EPYC Genoa |
|---|---|---|
| Process Node | TSMC 7nm | TSMC 5nm |
| Core Architecture | Zen 3 | Zen 4 |
| Zen CCD Die Size | 80mm2 | 72mm2 |
| Zen IOD Die Size | 416mm2 | 397mm2 |
| Substrate (Package) Area | TBD | 5428mm2 |
| Socket Area | 4410mm2 | 6080mm2 |
| Socket Name | LGA 4094 | LGA 6096 |
| Max Socket TDP | 450W | 700W |









