MediaTek has managed to surprise its competitors with the Dimensity 9300, shifting to a new CPU cluster and GPU pairing that outpaces the top-tier competition. With chipset orders for the Taiwanese firm increasing, Morgan Stanley analysts state that the latest SoC is the most powerful in the market right now and will aid MediaTek in taking its global market share to new heights.

A spike in Dimensity 9300 orders will allow MediaTek’s market share to rise up to 35 percent in 2024

A new report from Bloomberg states that MediaTek’s stock has risen by nearly 40 percent since the end of June, outperforming rival Qualcomm as demand for the manufacturer’s chipsets continues to rise, particularly in China. With the Snapdragon 8 Gen 3 rumored to be more expensive than the Snapdragon 8 Gen 2, which was already pricey at $160 per unit, high-end phone makers will look to capitalize on their margins. Since the Dimensity 9300 can outperform both the Snapdragon 8 Gen 3 and A17 Pro, it looks to be the obvious choice for most Android flagship vendors.

Morgan Stanley analysts Charlie Chan and Daisy Dai recognize the Dimensity 9300 as the most powerful smartphone SoC in the market right now, and its release is seeing new levels of traction, especially in the new Vivo X100 Pro. With the launch, the company’s current market share of 20 percent in 2023 is expected to reach between 30 to 35 percent in 2024. In overall shipments, MediaTek will reportedly reach 20 million units during this time, which is a new record.

MediaTek currently possesses a market capitalization of over $47 billion, making it the second-largest semiconductor firm in Taiwan behind TSMC. While the Dimensity 9300’s strengths are unquestionable, switching to a new CPU cluster that does not feature any power-efficient cores comes with one major drawback; increased power consumption. In an earlier CPU throttling test, the Dimensity 9300 lost 46 percent of its performancedue to this reason, despite the fact that the chipset was running inside the Vivo X100 Pro, which touts a vapor chamber.

Next year, MediaTek is rumored to switch to TSMC’s improved 3nm ‘N3E’ processfor the Dimensity 9400, which will give it upgraded power efficiency capabilities, so we look forward to seeing some improvements there.

News Source: Bloomberg